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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    44-6553-16

    44-6553-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 4,074
    RFQ
    		44-6553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    44-3551-16

    44-3551-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 4,115
    RFQ
    		44-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    44-3552-16

    44-3552-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 3,351
    RFQ
    		44-3552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    44-3553-16

    44-3553-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 2,414
    RFQ
    		44-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    44-6551-16

    44-6551-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 3,017
    RFQ
    		44-6551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    44-6554-16

    44-6554-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 2,843
    RFQ
    		44-6554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
    175-PGM16003-11

    175-PGM16003-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,162
    RFQ
    		175-PGM16003-11

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    42-6574-16

    42-6574-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,933
    RFQ
    		42-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    42-3572-16

    42-3572-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 2,813
    RFQ
    		42-3572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    42-6571-16

    42-6571-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 3,269
    RFQ
    		42-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    Total 4131 Record«Prev1... 381382383384385386387388...414Next»
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