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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
44-3551-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,946 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-3552-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
4,111 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-3553-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,716 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-6551-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
4,248 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-6552-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
2,089 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-6553-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
4,703 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-3554-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,247 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
44-6554-18CONN IC DIP SOCKET ZIF 44POS Aries Electronics |
3,125 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
36-6552-18CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
3,885 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
36-6553-18CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics |
2,049 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
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