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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
40-0518-11CONN SOCKET SIP 40POS GOLD Aries Electronics |
85 |
|
Datasheet |
518 | Bulk | Active | SIP | 40 (1 x 40) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
24-526-10CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics |
62 |
|
Datasheet |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
24-6554-10CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics |
63 |
|
Datasheet |
55 | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
40-526-10CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics |
74 |
|
Datasheet |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 40 (2 x 20) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
28-6554-10CONN IC DIP SOCKET ZIF 28POS TIN Aries Electronics |
85 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
25-0503-30CONN SOCKET SIP 25POS GOLD Aries Electronics |
76 |
|
Datasheet |
0503 | Bulk | Active | SIP | 25 (1 x 25) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
24-6554-11CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
95 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | - | Beryllium Copper |
|
48-6554-10CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics |
79 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
40-6554-11CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics |
31 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | - | Beryllium Copper |
|
108-PRS12005-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
7 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
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