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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    08-810-90

    08-810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    60
    RFQ
    08-810-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    40-C182-10

    40-C182-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    68
    RFQ
    40-C182-10

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-810-90C

    16-810-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    49
    RFQ
    16-810-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    18-6810-90T

    18-6810-90T

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    41
    RFQ
    18-6810-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    28-516-11

    28-516-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    43
    RFQ
    28-516-11

    Datasheet

    516 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
    16-2820-90C

    16-2820-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    95
    RFQ
    16-2820-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-526-11

    28-526-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    56
    RFQ
    28-526-11

    Datasheet

    Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
    44-547-11

    44-547-11

    CONN SOCKET SOIC ZIF 44POS GOLD

    Aries Electronics

    5
    RFQ
    44-547-11

    Datasheet

    547 Bulk Active SOIC, ZIF (ZIP) 44 (2 x 22) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame - Solder 0.050" (1.27mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 20.0µin (0.51µm) Beryllium Copper
    84-537-21

    84-537-21

    CONN SOCKET PLCC ZIF 84POS GOLD

    Aries Electronics

    4
    RFQ
    84-537-21

    Datasheet

    537 - Active PLCC, ZIF (ZIP) 84 (4 x 21) Gold 12.0µin (0.30µm) - Surface Mount Closed Frame 0.100" (2.54mm) - - - - - - -
    14-8400-10

    14-8400-10

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    33
    RFQ
    14-8400-10

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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