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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    11-0508-30

    11-0508-30

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    4,919
    RFQ
    11-0508-30

    Datasheet

    508 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    16-3518-101H

    16-3518-101H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,214
    RFQ
    16-3518-101H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    30-0518-10T

    30-0518-10T

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,568
    RFQ
    30-0518-10T

    Datasheet

    518 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-6513-11

    20-6513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,508
    RFQ
    20-6513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    20-0513-11

    20-0513-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,515
    RFQ
    20-0513-11

    Datasheet

    0513 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    23-0513-10H

    23-0513-10H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    3,056
    RFQ
    23-0513-10H

    Datasheet

    0513 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-4518-10M

    20-4518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,735
    RFQ
    20-4518-10M

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    38-0518-10H

    38-0518-10H

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,505
    RFQ
    38-0518-10H

    Datasheet

    518 Bulk Active SIP 38 (1 x 38) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    38-1518-10H

    38-1518-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,322
    RFQ
    38-1518-10H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-6513-10T

    24-6513-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,551
    RFQ
    24-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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