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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
32-0518-11CONN SOCKET SIP 32POS GOLD Aries Electronics |
2,478 |
|
Datasheet |
518 | Bulk | Active | SIP | 32 (1 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
08-820-90TCONN IC DIP SOCKET 8POS TIN Aries Electronics |
2,192 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
32-3513-10TCONN IC DIP SOCKET 32POS GOLD Aries Electronics |
4,377 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
29-0518-10HCONN SOCKET SIP 29POS GOLD Aries Electronics |
3,538 |
|
Datasheet |
518 | Bulk | Active | SIP | 29 (1 x 29) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
06-0508-21CONN SOCKET SIP 6POS GOLD Aries Electronics |
4,177 |
|
Datasheet |
508 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
06-0508-31CONN SOCKET SIP 6POS GOLD Aries Electronics |
4,533 |
|
Datasheet |
508 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
06-1508-21CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
2,134 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
06-1508-31CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
4,072 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
28-3518-11CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,577 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
21-0513-11CONN SOCKET SIP 21POS GOLD Aries Electronics |
4,644 |
|
Datasheet |
0513 | Bulk | Active | SIP | 21 (1 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
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