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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
22-0513-11CONN SOCKET SIP 22POS GOLD Aries Electronics |
3,829 |
|
Datasheet |
0513 | Bulk | Active | SIP | 22 (1 x 22) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
34-1518-11CONN IC DIP SOCKET 34POS GOLD Aries Electronics |
3,143 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 34 (2 x 17) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
10-0503-20CONN SOCKET SIP 10POS GOLD Aries Electronics |
2,432 |
|
Datasheet |
0503 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
10-0503-30CONN SOCKET SIP 10POS GOLD Aries Electronics |
4,402 |
|
Datasheet |
0503 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
20-0518-11HCONN SOCKET SIP 20POS GOLD Aries Electronics |
3,710 |
|
Datasheet |
518 | Bulk | Active | SIP | 20 (1 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
34-0518-11CONN SOCKET SIP 34POS GOLD Aries Electronics |
3,347 |
|
Datasheet |
518 | Bulk | Active | SIP | 34 (1 x 34) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
C9124-00CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
4,714 |
|
Datasheet |
Edge-Grip™, C91 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
22-4513-11CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
2,698 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
29-0518-11CONN SOCKET SIP 29POS GOLD Aries Electronics |
4,255 |
|
Datasheet |
518 | Bulk | Active | SIP | 29 (1 x 29) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
32-6518-00CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,911 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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