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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    08-2511-11

    08-2511-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 2,827
    RFQ
    		08-2511-11

    Datasheet

         		511 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-0508-20

    12-0508-20

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    		 4,691
    RFQ
    		12-0508-20

    Datasheet

         		508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    12-0508-30

    12-0508-30

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    		 3,974
    RFQ
    		12-0508-30

    Datasheet

         		508 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    12-1508-20

    12-1508-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 3,796
    RFQ
    		12-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    12-1508-30

    12-1508-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 2,056
    RFQ
    		12-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    28-0518-11

    28-0518-11

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    		 2,457
    RFQ
    		28-0518-11

    Datasheet

         		518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6513-11H

    10-6513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,452
    RFQ
    		10-6513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2503-20

    08-2503-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,509
    RFQ
    		08-2503-20

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    05-0511-10

    05-0511-10

    CONN SOCKET SIP 5POS TIN

    Aries Electronics

    		 4,832
    RFQ
    		05-0511-10

    Datasheet

         		511 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-0511-10

    10-0511-10

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    		 3,643
    RFQ
    		10-0511-10

    Datasheet

         		511 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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