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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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13-0508-20CONN SOCKET SIP 13POS GOLD Aries Electronics |
2,783 |
|
Datasheet |
508 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
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13-0508-30CONN SOCKET SIP 13POS GOLD Aries Electronics |
2,326 |
|
Datasheet |
508 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
06-6820-90CCONN IC DIP SOCKET 6POS GOLD Aries Electronics |
4,284 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
36-6511-10CONN IC DIP SOCKET 36POS TIN Aries Electronics |
2,398 |
|
Datasheet |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
40-6518-10TCONN IC DIP SOCKET 40POS GOLD Aries Electronics |
4,258 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
08-3501-21CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,701 |
|
Datasheet |
501 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
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08-3501-31CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
4,218 |
|
Datasheet |
501 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
09-0503-20CONN SOCKET SIP 9POS GOLD Aries Electronics |
4,606 |
|
Datasheet |
0503 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
12-0517-90CCONN SOCKET SIP 12POS GOLD Aries Electronics |
3,496 |
|
Datasheet |
0517 | Bulk | Active | SIP | 12 (1 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | - | Solder | - | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
28-3518-00CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,174 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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