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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    08-6503-20

    08-6503-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,505
    RFQ
    08-6503-20

    Datasheet

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    14-6501-30

    14-6501-30

    .6 WW SOCKET

    Aries Electronics

    4,624
    RFQ

    -

    501 - Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    14-6501-20

    14-6501-20

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,035
    RFQ
    14-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    24-3518-10H

    24-3518-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,303
    RFQ
    24-3518-10H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-3501-20

    16-3501-20

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    4,518
    RFQ
    16-3501-20

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-3501-30

    16-3501-30

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    2,135
    RFQ
    16-3501-30

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    35-0518-11

    35-0518-11

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    2,376
    RFQ
    35-0518-11

    Datasheet

    518 Bulk Active SIP 35 (1 x 35) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    18-3518-102

    18-3518-102

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,704
    RFQ
    18-3518-102

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    18-3518-101

    18-3518-101

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,391
    RFQ
    18-3518-101

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    36-6513-10T

    36-6513-10T

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,612
    RFQ
    36-6513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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