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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A-CCS28-ZCONN SOCKET PLCC 28POS TIN Assmann WSW Components |
2,629 |
|
Datasheet |
- | Bag | Obsolete | PLCC | 28 (4 x 7) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 150.0µin (3.81µm) | Phosphor Bronze |
|
AW 127-22/Z-TSOCKET 22 CONTACTS SINGLE ROW Assmann WSW Components |
2,982 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
A 22-LC-TTIC-SOCKETS Assmann WSW Components |
2,020 |
|
- |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
|
AR 28-HZL/7-TTCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
2,017 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
AR18-HZL-TTCONN IC DIP SOCKET 18POS TIN Assmann WSW Components |
2,123 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
A24-LCGCONN IC DIP SOCKET 24POS GOLD Assmann WSW Components |
4,463 |
|
- |
- | - | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | - | 0.100" (2.54mm) | - | Gold | - | - | - |
|
|
AW 127-23/Z-TSOCKET 23 CONTACTS SINGLE ROW Assmann WSW Components |
2,667 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
A18-LCG-T-RCONN IC DIP SOCKET 18POS GOLD Assmann WSW Components |
4,081 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | - | - | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | - | - |
|
|
AR 14 HGL-TTSOCKET Assmann WSW Components |
2,228 |
|
Datasheet |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | Flash | Brass |
|
AR20-HZL/01-TTCONN IC DIP SOCKET 20POS GOLD Assmann WSW Components |
2,391 |
|
Datasheet |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
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