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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
A 14-LC-TRCONN IC DIP SOCKET 14POS TIN Assmann WSW Components |
3,787 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
A 16-LC-TRCONN IC DIP SOCKET 16POS TIN Assmann WSW Components |
3,935 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
A 18-LC-TTCONN IC DIP SOCKET 18POS TIN Assmann WSW Components |
7,873 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
A 18-LC-TRCONN IC DIP SOCKET 18POS TIN Assmann WSW Components |
3,037 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
A 24-LC-TTCONN IC DIP SOCKET 24POS TIN Assmann WSW Components |
1,965 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
AR 06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD Assmann WSW Components |
20,223 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
A 28-LC-TTCONN IC DIP SOCKET 28POS TIN Assmann WSW Components |
1,565 |
|
Datasheet |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
A 20-LC-TTCONN IC DIP SOCKET 20POS TIN Assmann WSW Components |
1,487 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 85°C | Tin | Polybutylene Terephthalate (PBT) | - | Phosphor Bronze |
|
AR 08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD Assmann WSW Components |
6,895 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 20-HZL-TTCONN IC DIP SOCKET 20POS TIN Assmann WSW Components |
1,980 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
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