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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
AR 14-HZL/01-TTCONN IC DIP SOCKET 14POS GOLD Assmann WSW Components |
9,397 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD Assmann WSW Components |
3,552 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 18-HZL-TTCONN IC DIP SOCKET 18POS TIN Assmann WSW Components |
652 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AR 14-HZL-TTCONN IC DIP SOCKET 14POS TIN Assmann WSW Components |
372 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
AW 127-20/G-TSOCKET, MACHINED CONTACTS, SGL. Assmann WSW Components |
828 |
|
Datasheet |
- | Bag | Active | - | - | Gold | Flash | - | Through Hole | - | 0.100" (2.54mm) | Solder | - | -40°C ~ 105°C | Gold | - | Flash | - |
|
A-CCS 044-Z-SMIC SOCKET PLCC 44POS TIN SMD Assmann WSW Components |
4,820 |
|
Datasheet |
- | Tube | Active | PLCC | 44 (4 x 11) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polyamide (PA9T), Nylon 9T, Glass Filled | 160.0µin (4.06µm) | Phosphor Bronze |
|
A-CCS 032-Z-TCONN SOCKET PLCC 32POS TIN Assmann WSW Components |
2,533 |
|
Datasheet |
- | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
|
A-CCS 028-Z-TCONN SOCKET PLCC 28POS TIN Assmann WSW Components |
764 |
|
Datasheet |
- | Tube | Active | PLCC | 28 (4 x 7) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
|
AR 16-HZL/01-TTCONN IC DIP SOCKET 16POS GOLD Assmann WSW Components |
5,069 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Beryllium Copper |
|
A-CCS 052-Z-TIC SOCKET PLCC 52POS TIN Assmann WSW Components |
1,119 |
|
Datasheet |
- | Tube | Active | PLCC | 52 (4 x 13) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 160.0µin (4.06µm) | Phosphor Bronze |
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