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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    123-87-650-41-001101

    123-87-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 3,721
    RFQ
    		123-87-650-41-001101

    Datasheet

         		123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0310-TT-22

    HLS-0310-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,431
    RFQ
    		HLS-0310-TT-22

    Datasheet

         		HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    614-83-950-31-012101

    614-83-950-31-012101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 2,994
    RFQ
    		614-83-950-31-012101

    Datasheet

         		614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0511-11

    02-0511-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    		 2,678
    RFQ
    		02-0511-11

    Datasheet

         		511 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-2503-21

    06-2503-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 2,407
    RFQ
    		06-2503-21

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-2503-31

    06-2503-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 2,000
    RFQ
    		06-2503-31

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-6503-20

    12-6503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 3,784
    RFQ
    		12-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6503-30

    12-6503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 4,915
    RFQ
    		12-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-0517-90C

    16-0517-90C

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 2,223
    RFQ
    		16-0517-90C

    Datasheet

         		0517 Bulk Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    146-83-640-41-035101

    146-83-640-41-035101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    		 3,373
    RFQ
    		146-83-640-41-035101

    Datasheet

         		146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-640-41-036101

    146-83-640-41-036101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    		 2,196
    RFQ
    		146-83-640-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PGA168H008B5-1706R

    PGA168H008B5-1706R

    PGA SOCKET 168 CTS

    Amphenol ICC (FCI)

    		 4,864
    RFQ
    		PGA168H008B5-1706R

    Datasheet

         		- - Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
    124-83-432-41-002101

    124-83-432-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 3,728
    RFQ

    -

    		 124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0116-T-10

    HLS-0116-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,049
    RFQ
    		HLS-0116-T-10

    Datasheet

         		HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    4594

    4594

    CONN SOCKET TRANSIST TO100 10POS

    Keystone Electronics

    		 3,063
    RFQ
    		4594

    Datasheet

         		- Bulk Active Transistor, TO-100 10 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    116-83-648-41-006101

    116-83-648-41-006101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    		 4,168
    RFQ
    		116-83-648-41-006101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    13-0511-10

    13-0511-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    		 3,648
    RFQ
    		13-0511-10

    Datasheet

         		511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-159-16-071101

    510-87-159-16-071101

    CONN SOCKET PGA 159POS GOLD

    Preci-Dip

    		 3,736
    RFQ
    		510-87-159-16-071101

    Datasheet

         		510 Bulk Active PGA 159 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-648-41-007101

    116-87-648-41-007101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    		 2,736
    RFQ
    		116-87-648-41-007101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-G-2

    HLS-0112-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,475
    RFQ
    		HLS-0112-G-2

    Datasheet

         		HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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