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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-822-90C

    10-822-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,387
    RFQ
    10-822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-316-T-C

    APO-316-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,958
    RFQ
    APO-316-T-C

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-432-41-011101

    116-83-432-41-011101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,629
    RFQ
    116-83-432-41-011101

    Datasheet

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-088-12-051101

    510-83-088-12-051101

    CONN SOCKET PGA 88POS GOLD

    Preci-Dip

    2,272
    RFQ
    510-83-088-12-051101

    Datasheet

    510 Bulk Active PGA 88 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 28-HZL/07-TT

    AR 28-HZL/07-TT

    CONN IC DIP SOCKET 28POS GOLD

    Assmann WSW Components

    3
    RFQ
    AR 28-HZL/07-TT

    Datasheet

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    08-0503-21

    08-0503-21

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,477
    RFQ
    08-0503-21

    Datasheet

    0503 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    08-0503-31

    08-0503-31

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,565
    RFQ
    08-0503-31

    Datasheet

    0503 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    14-3518-10M

    14-3518-10M

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,393
    RFQ
    14-3518-10M

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0207-T-11

    HLS-0207-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,268
    RFQ
    HLS-0207-T-11

    Datasheet

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    APO-422-T-A1

    APO-422-T-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,166
    RFQ
    APO-422-T-A1

    Datasheet

    APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    299-87-620-10-002101

    299-87-620-10-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,021
    RFQ
    299-87-620-10-002101

    Datasheet

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0206-T-18

    HLS-0206-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,610
    RFQ
    HLS-0206-T-18

    Datasheet

    HLS Tube Active SIP 12 (2 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    212-1-40-006

    212-1-40-006

    CONN IC DIP SOCKET 40POS GOLD

    CNC Tech

    3,984
    RFQ
    212-1-40-006

    Datasheet

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    116-83-632-41-011101

    116-83-632-41-011101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,093
    RFQ
    116-83-632-41-011101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-316-T-A

    APO-316-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,513
    RFQ
    APO-316-T-A

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APH-0902-G-H

    APH-0902-G-H

    APH-0902-G-H

    Samtec Inc.

    3,283
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1002-G-H

    APH-1002-G-H

    APH-1002-G-H

    Samtec Inc.

    3,880
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1902-G-H

    APH-1902-G-H

    APH-1902-G-H

    Samtec Inc.

    4,549
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1602-G-H

    APH-1602-G-H

    APH-1602-G-H

    Samtec Inc.

    3,106
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0202-G-H

    APH-0202-G-H

    APH-0202-G-H

    Samtec Inc.

    2,881
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
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