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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1908-T-T

    APH-1908-T-T

    APH-1908-T-T

    Samtec Inc.

    3,760
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0208-T-T

    APH-0208-T-T

    APH-0208-T-T

    Samtec Inc.

    2,168
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0708-T-T

    APH-0708-T-T

    APH-0708-T-T

    Samtec Inc.

    3,563
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1808-T-T

    APH-1808-T-T

    APH-1808-T-T

    Samtec Inc.

    3,307
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1708-T-T

    APH-1708-T-T

    APH-1708-T-T

    Samtec Inc.

    3,846
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0408-T-T

    APH-0408-T-T

    APH-0408-T-T

    Samtec Inc.

    4,308
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0908-T-T

    APH-0908-T-T

    APH-0908-T-T

    Samtec Inc.

    2,001
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0808-T-T

    APH-0808-T-T

    APH-0808-T-T

    Samtec Inc.

    4,085
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1308-T-T

    APH-1308-T-T

    APH-1308-T-T

    Samtec Inc.

    3,420
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    XR2A-2025

    XR2A-2025

    CONN IC DIP SOCKET 20POS GOLD

    Omron Electronics Inc-EMC Div

    2,845
    RFQ
    XR2A-2025

    Datasheet

    XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    18-6513-10H

    18-6513-10H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,965
    RFQ
    18-6513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-9513-11

    20-9513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,286
    RFQ
    20-9513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2822-90

    08-2822-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,541
    RFQ
    08-2822-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-2823-90

    08-2823-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,844
    RFQ
    08-2823-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-820-90

    08-820-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,598
    RFQ
    08-820-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-822-90

    08-822-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,456
    RFQ
    08-822-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    17-0517-90C

    17-0517-90C

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,490
    RFQ
    17-0517-90C

    Datasheet

    0517 Bulk Active SIP 17 (1 x 17) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-314-NGT

    ICO-314-NGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,078
    RFQ
    ICO-314-NGT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-87-168-17-001101

    510-87-168-17-001101

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    4,919
    RFQ
    510-87-168-17-001101

    Datasheet

    510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-168-17-101101

    510-87-168-17-101101

    CONN SOCKET PGA 168POS GOLD

    Preci-Dip

    4,362
    RFQ
    510-87-168-17-101101

    Datasheet

    510 Bulk Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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