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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    30-0518-00

    30-0518-00

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 3,982
    RFQ
    		30-0518-00

    Datasheet

         		518 Bulk Active SIP 30 (1 x 30) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    30-1518-00

    30-1518-00

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,309
    RFQ
    		30-1518-00

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-81250-610C

    08-81250-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,599
    RFQ
    		08-81250-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    08-8305-610C

    08-8305-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,069
    RFQ
    		08-8305-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    116-87-650-41-009101

    116-87-650-41-009101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 2,547
    RFQ
    		116-87-650-41-009101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-169-17-101101

    510-87-169-17-101101

    CONN SOCKET PGA 169POS GOLD

    Preci-Dip

    		 4,529
    RFQ
    		510-87-169-17-101101

    Datasheet

         		510 Bulk Active PGA 169 (17 x 17) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    116-83-636-41-001101

    116-83-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    		 4,002
    RFQ
    		116-83-636-41-001101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    ICA-314-ZWGT-3

    ICA-314-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,425
    RFQ
    		ICA-314-ZWGT-3

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    HLS-0405-S-2

    HLS-0405-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,115
    RFQ
    		HLS-0405-S-2

    Datasheet

         		HLS Bulk Active SIP 20 (4 x 5) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    28-6518-10M

    28-6518-10M

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,307
    RFQ
    		28-6518-10M

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-71000-10

    08-71000-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 4,184
    RFQ
    		08-71000-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-71250-10

    08-71250-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 3,001
    RFQ
    		08-71250-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7350-10

    08-7350-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 3,455
    RFQ
    		08-7350-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7350-11

    08-7350-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 3,272
    RFQ
    		08-7350-11

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    08-7360-10

    08-7360-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 3,997
    RFQ
    		08-7360-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7390-10

    08-7390-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 2,164
    RFQ
    		08-7390-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7400-10

    08-7400-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 2,832
    RFQ
    		08-7400-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7425-10

    08-7425-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 2,667
    RFQ
    		08-7425-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7430-10

    08-7430-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 2,840
    RFQ
    		08-7430-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-7445-10

    08-7445-10

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    		 4,200
    RFQ
    		08-7445-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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