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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICA-624-KGT

    ICA-624-KGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,769
    RFQ
    		ICA-624-KGT

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-624-KGT

    ICO-624-KGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,330
    RFQ
    		ICO-624-KGT

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-324-KGT

    ICO-324-KGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,349
    RFQ
    		ICO-324-KGT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    10-2823-90

    10-2823-90

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,750
    RFQ
    		10-2823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    14-822-90E

    14-822-90E

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 3,705
    RFQ
    		14-822-90E

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    115-41-304-41-001000

    115-41-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,275
    RFQ
    		115-41-304-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-304-41-001000

    115-91-304-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,262
    RFQ
    		115-91-304-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-87-179-15-041101

    510-87-179-15-041101

    CONN SOCKET PGA 179POS GOLD

    Preci-Dip

    		 3,483
    RFQ
    		510-87-179-15-041101

    Datasheet

         		510 Bulk Active PGA 179 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-632-F-I

    ICF-632-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 2,627
    RFQ
    		ICF-632-F-I

    Datasheet

         		ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-632-F-O

    ICF-632-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 3,689
    RFQ
    		ICF-632-F-O

    Datasheet

         		ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICO-318-ZCGT

    ICO-318-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,563
    RFQ
    		ICO-318-ZCGT

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    346-93-123-41-013000

    346-93-123-41-013000

    CONN SOCKET SIP 23POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,749
    RFQ
    		346-93-123-41-013000

    Datasheet

         		346 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-123-41-013000

    346-43-123-41-013000

    CONN SOCKET SIP 23POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,055
    RFQ
    		346-43-123-41-013000

    Datasheet

         		346 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    26-0511-10

    26-0511-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 4,029
    RFQ
    		26-0511-10

    Datasheet

         		511 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-20

    14-3508-20

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,980
    RFQ
    		14-3508-20

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-30

    14-3508-30

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 3,813
    RFQ
    		14-3508-30

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-81000-310C

    10-81000-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 2,124
    RFQ
    		10-81000-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-81070-310C

    10-81070-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,185
    RFQ
    		10-81070-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-81250-310C

    10-81250-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,551
    RFQ
    		10-81250-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8250-310C

    10-8250-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 2,199
    RFQ
    		10-8250-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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