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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    06-0501-21

    06-0501-21

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    		 3,011
    RFQ
    		06-0501-21

    Datasheet

         		501 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-0501-31

    06-0501-31

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    		 2,063
    RFQ
    		06-0501-31

    Datasheet

         		501 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    15-0503-30

    15-0503-30

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    		 2,281
    RFQ
    		15-0503-30

    Datasheet

         		0503 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    26-1518-11H

    26-1518-11H

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,218
    RFQ
    		26-1518-11H

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-318-MGG

    ICO-318-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,245
    RFQ
    		ICO-318-MGG

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-642-41-001101

    116-83-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    		 3,569
    RFQ
    		116-83-642-41-001101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-ZWGT-3

    ICA-320-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,112
    RFQ
    		ICA-320-ZWGT-3

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-650-41-007101

    116-83-650-41-007101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 2,854
    RFQ
    		116-83-650-41-007101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-4518-11H

    20-4518-11H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,935
    RFQ
    		20-4518-11H

    Datasheet

         		518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-0517-90C

    20-0517-90C

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    		 4,113
    RFQ
    		20-0517-90C

    Datasheet

         		0517 Bulk Active SIP 20 (1 x 20) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-181-15-001101

    510-87-181-15-001101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    		 3,757
    RFQ
    		510-87-181-15-001101

    Datasheet

         		510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-181-15-051101

    510-87-181-15-051101

    CONN SOCKET PGA 181POS GOLD

    Preci-Dip

    		 4,447
    RFQ
    		510-87-181-15-051101

    Datasheet

         		510 Bulk Active PGA 181 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-43-632-31-012000

    614-43-632-31-012000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,962
    RFQ
    		614-43-632-31-012000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-314-ZNGG

    ICO-314-ZNGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,471
    RFQ
    		ICO-314-ZNGG

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APH-0906-T-H

    APH-0906-T-H

    APH-0906-T-H

    Samtec Inc.

    		 4,472
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0606-T-H

    APH-0606-T-H

    APH-0606-T-H

    Samtec Inc.

    		 3,943
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1706-T-H

    APH-1706-T-H

    APH-1706-T-H

    Samtec Inc.

    		 4,301
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0706-T-H

    APH-0706-T-H

    APH-0706-T-H

    Samtec Inc.

    		 4,674
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0806-T-H

    APH-0806-T-H

    APH-0806-T-H

    Samtec Inc.

    		 2,464
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-83-650-41-012101

    116-83-650-41-012101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 2,303
    RFQ
    		116-83-650-41-012101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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