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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    HLS-0210-T-30

    HLS-0210-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,782
    RFQ
    HLS-0210-T-30

    Datasheet

    HLS Tube Active SIP 20 (2 x 10) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    HLS-0118-G-2

    HLS-0118-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,979
    RFQ
    HLS-0118-G-2

    Datasheet

    HLS Tube Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    36-3513-10

    36-3513-10

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,551
    RFQ
    36-3513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    HLS-0306-T-11

    HLS-0306-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,817
    RFQ
    HLS-0306-T-11

    Datasheet

    HLS Tube Active SIP 18 (3 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    30-0511-10

    30-0511-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    3,434
    RFQ
    30-0511-10

    Datasheet

    511 Bulk Active SIP 30 (1 x 30) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
    ICA-314-AGT

    ICA-314-AGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,716
    RFQ
    ICA-314-AGT

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    06-3508-31

    06-3508-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,281
    RFQ
    06-3508-31

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    20-6823-90T

    20-6823-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    3,257
    RFQ
    20-6823-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    510-87-184-15-001101

    510-87-184-15-001101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    4,444
    RFQ
    510-87-184-15-001101

    Datasheet

    510 Bulk Active PGA 184 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    06-3503-21

    06-3503-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,444
    RFQ
    06-3503-21

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    124-83-640-41-002101

    124-83-640-41-002101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,891
    RFQ

    -

    124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    ICO-314-ZMGG

    ICO-314-ZMGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,121
    RFQ
    ICO-314-ZMGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    550-80-056-09-041101

    550-80-056-09-041101

    PGA SOLDER TAIL

    Preci-Dip

    3,931
    RFQ
    550-80-056-09-041101

    Datasheet

    550 Bulk Active PGA 56 (9 x 9) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    115-93-304-41-001000

    115-93-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    2,293
    RFQ
    115-93-304-41-001000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-43-304-41-001000

    115-43-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,674
    RFQ
    115-43-304-41-001000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    08-6823-90

    08-6823-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,489
    RFQ
    08-6823-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    10-81250-610C

    10-81250-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,425
    RFQ
    10-81250-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8335-610C

    10-8335-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,657
    RFQ
    10-8335-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8340-610C

    10-8340-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,011
    RFQ
    10-8340-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8433-610C

    10-8433-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,084
    RFQ
    10-8433-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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