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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-0604-G-TAPH-0604-G-T |
3,911 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1806-T-RAPH-1806-T-R |
4,599 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1406-T-RAPH-1406-T-R |
3,261 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0804-G-TAPH-0804-G-T |
3,508 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0806-T-RAPH-0806-T-R |
2,756 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1804-G-TAPH-1804-G-T |
4,256 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1704-G-TAPH-1704-G-T |
2,012 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0404-G-TAPH-0404-G-T |
4,293 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
31-0518-11HCONN SOCKET SIP 31POS GOLD |
4,428 |
|
Datasheet |
518 | Bulk | Active | SIP | 31 (1 x 31) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
510-87-181-17-082101CONN SOCKET PGA 181POS GOLD |
4,259 |
|
Datasheet |
510 | Bulk | Active | PGA | 181 (17 x 17) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
31-0511-10CONN SOCKET SIP 31POS TIN |
3,011 |
|
Datasheet |
511 | Bulk | Active | SIP | 31 (1 x 31) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 50.0µin (1.27µm) | Phosphor Bronze |
|
|
116-47-304-41-006000STANDRD SOLDRTL DBL SKT |
3,279 |
|
Datasheet |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
ICO-320-ZSGG.100" LOW PROFILE SCREW MACHINE |
2,361 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
347843-5CONN IC DIP SOCKET 10POS TINLEAD |
2,970 |
|
- |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Tin-Lead | - | Beryllium Copper | Through Hole, Right Angle, Horizontal | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | - | - | Beryllium Copper |
|
|
MVAS-114-ZSGT-13CONN SOCKET PGA 114POS GOLD |
2,765 |
|
Datasheet |
MVAS | Tube | Obsolete | PGA | 114 (13 x 13) | Gold | 30.0µin (0.76µm) | - | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | - | 30.0µin (0.76µm) | - |
|
|
19-0508-20CONN SOCKET SIP 19POS GOLD |
2,916 |
|
Datasheet |
508 | Bulk | Active | SIP | 19 (1 x 19) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
19-0508-30CONN SOCKET SIP 19POS GOLD |
4,285 |
|
Datasheet |
508 | Bulk | Active | SIP | 19 (1 x 19) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
346-93-124-41-013000CONN SOCKET SIP 24POS GOLD |
4,677 |
|
Datasheet |
346 | Tube | Active | SIP | 24 (1 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
346-43-124-41-013000CONN SOCKET SIP 24POS GOLD |
2,527 |
|
Datasheet |
346 | Bulk | Active | SIP | 24 (1 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
HIC-764-SSTCONN IC DIP SOCKET 64POS GOLD |
2,608 |
|
Datasheet |
HIC | Tube | Obsolete | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | - | Gold | Polyester, Glass Filled | 200.0µin (5.08µm) | Brass |
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