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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    08-2503-21

    08-2503-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,364
    RFQ
    08-2503-21

    Datasheet

    503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-41-304-41-006000

    116-41-304-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,059
    RFQ
    116-41-304-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-304-41-006000

    116-91-304-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,206
    RFQ
    116-91-304-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-0511-10

    32-0511-10

    CONN SOCKET SIP 32POS TIN

    Aries Electronics

    2,852
    RFQ
    32-0511-10

    Datasheet

    511 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-0518-00

    36-0518-00

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    2,645
    RFQ
    36-0518-00

    Datasheet

    518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-1518-00

    36-1518-00

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,667
    RFQ
    36-1518-00

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-624-SGG

    ICO-624-SGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,399
    RFQ
    ICO-624-SGG

    Datasheet

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-SGG

    ICA-624-SGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,997
    RFQ
    ICA-624-SGG

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-324-SGG

    ICO-324-SGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,786
    RFQ
    ICO-324-SGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-624-ZLGT

    ICO-624-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,937
    RFQ
    ICO-624-ZLGT

    Datasheet

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    16-3501-21

    16-3501-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,330
    RFQ
    16-3501-21

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-3501-31

    16-3501-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,838
    RFQ
    16-3501-31

    Datasheet

    501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-0511-10

    28-0511-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    2,201
    RFQ
    28-0511-10

    Datasheet

    511 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C182-10H

    24-C182-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,492
    RFQ
    24-C182-10H

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6810-90T

    08-6810-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,855
    RFQ
    08-6810-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    12-6822-90C

    12-6822-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,802
    RFQ
    12-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6823-90C

    12-6823-90C

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,444
    RFQ
    12-6823-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-184-17-081101

    510-87-184-17-081101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    2,810
    RFQ
    510-87-184-17-081101

    Datasheet

    510 Bulk Active PGA 184 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2-5916783-2

    2-5916783-2

    CONN SOCKET PGA ZIF 370POS GOLD

    TE Connectivity AMP Connectors

    4,724
    RFQ

    -

    - Tray Obsolete PGA, ZIF (ZIP) 370 (19 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Copper Alloy Liquid Crystal Polymer (LCP) -
    714-43-119-31-018000

    714-43-119-31-018000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    4,185
    RFQ
    714-43-119-31-018000

    Datasheet

    714 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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