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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    22-6501-20

    22-6501-20

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    		 3,373
    RFQ
    		22-6501-20

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-6501-30

    22-6501-30

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    		 3,061
    RFQ
    		22-6501-30

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    09-0501-20

    09-0501-20

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    		 3,186
    RFQ
    		09-0501-20

    Datasheet

         		501 Bulk Active SIP 9 (1 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    33-0511-10

    33-0511-10

    CONN SOCKET SIP 33POS TIN

    Aries Electronics

    		 4,746
    RFQ
    		33-0511-10

    Datasheet

         		511 Bulk Active SIP 33 (1 x 33) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
    824-AG30D

    824-AG30D

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    		 3,169
    RFQ
    		824-AG30D

    Datasheet

         		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
    14-823-90C

    14-823-90C

    IC SOCKET 14PIN VERT SCKT HORIZ

    Aries Electronics

    		 2,608
    RFQ

    -

    		 Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-3518-01

    16-3518-01

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,534
    RFQ
    		16-3518-01

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-6823-90T

    16-6823-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 3,846
    RFQ
    		16-6823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    16-822-90T

    16-822-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 3,630
    RFQ
    		16-822-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    14-4820-90C

    14-4820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,609
    RFQ
    		14-4820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-4823-90C

    14-4823-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,155
    RFQ
    		14-4823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-6820-90C

    14-6820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,948
    RFQ
    		14-6820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-6822-90C

    14-6822-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,274
    RFQ
    		14-6822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-6823-90C

    14-6823-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,526
    RFQ
    		14-6823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-820-90C

    14-820-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,810
    RFQ
    		14-820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-822-90C

    14-822-90C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,467
    RFQ
    		14-822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    ICA-422-WGT-2

    ICA-422-WGT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,910
    RFQ
    		ICA-422-WGT-2

    Datasheet

         		ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    32-1518-11H

    32-1518-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,145
    RFQ
    		32-1518-11H

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    ICF-640-TM-O

    ICF-640-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 4,998
    RFQ
    		ICF-640-TM-O

    Datasheet

         		ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    HLS-0120-T-11

    HLS-0120-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,551
    RFQ
    		HLS-0120-T-11

    Datasheet

         		HLS Tube Active SIP 20 (1 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
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