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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-648-41-001101

    116-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,808
    RFQ
    116-87-648-41-001101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-304-41-003000

    116-41-304-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,131
    RFQ
    116-41-304-41-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-304-41-003000

    116-91-304-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,230
    RFQ
    116-91-304-41-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    07-0501-21

    07-0501-21

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,756
    RFQ
    07-0501-21

    Datasheet

    501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    07-0501-31

    07-0501-31

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    3,087
    RFQ
    07-0501-31

    Datasheet

    501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICO-314-AGG

    ICO-314-AGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,170
    RFQ
    ICO-314-AGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-AGG

    ICA-314-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,590
    RFQ
    ICA-314-AGG

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    26-3513-11

    26-3513-11

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,440
    RFQ
    26-3513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-652-41-011101

    116-87-652-41-011101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,429
    RFQ
    116-87-652-41-011101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    29-0511-10

    29-0511-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    4,824
    RFQ
    29-0511-10

    Datasheet

    511 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4513-11H

    22-4513-11H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,830
    RFQ
    22-4513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3503-20

    18-3503-20

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,684
    RFQ
    18-3503-20

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3503-30

    18-3503-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,926
    RFQ
    18-3503-30

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-87-626-10-002101

    299-87-626-10-002101

    CONN IC DIP SOCKET 26POS GOLD

    Preci-Dip

    2,579
    RFQ
    299-87-626-10-002101

    Datasheet

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-318-T-P

    APA-318-T-P

    ADAPTER PLUG

    Samtec Inc.

    2,117
    RFQ
    APA-318-T-P

    Datasheet

    APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-316-STL-I

    ICF-316-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,848
    RFQ
    ICF-316-STL-I

    Datasheet

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-STL-O

    ICF-316-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,890
    RFQ
    ICF-316-STL-O

    Datasheet

    ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    10-0501-20

    10-0501-20

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,905
    RFQ
    10-0501-20

    Datasheet

    501 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-0501-30

    10-0501-30

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,853
    RFQ
    10-0501-30

    Datasheet

    501 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-624-ZSGT-L

    ICA-624-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,552
    RFQ
    ICA-624-ZSGT-L

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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