Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    605-41-304-11-480000

    605-41-304-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,731
    RFQ
    605-41-304-11-480000

    Datasheet

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-304-11-480000

    605-91-304-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,124
    RFQ
    605-91-304-11-480000

    Datasheet

    605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    5-1437535-4

    5-1437535-4

    CONN SOCKET SIP 20POS GOLD

    TE Connectivity AMP Connectors

    4,427
    RFQ

    -

    500 Tube Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
    34-0518-11H

    34-0518-11H

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    4,764
    RFQ
    34-0518-11H

    Datasheet

    518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-1518-11H

    34-1518-11H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    2,537
    RFQ
    34-1518-11H

    Datasheet

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-6820-90TWR

    20-6820-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    2,395
    RFQ
    20-6820-90TWR

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    116-87-628-41-013101

    116-87-628-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,366
    RFQ
    116-87-628-41-013101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-133-13-002101

    510-83-133-13-002101

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    2,644
    RFQ
    510-83-133-13-002101

    Datasheet

    510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-133-13-041101

    510-83-133-13-041101

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    4,122
    RFQ
    510-83-133-13-041101

    Datasheet

    510 Bulk Active PGA 133 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3518-10E

    24-3518-10E

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,678
    RFQ
    24-3518-10E

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-224-18-091101

    510-87-224-18-091101

    CONN SOCKET PGA 224POS GOLD

    Preci-Dip

    3,023
    RFQ
    510-87-224-18-091101

    Datasheet

    510 Bulk Active PGA 224 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0503-21

    11-0503-21

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,081
    RFQ
    11-0503-21

    Datasheet

    0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    11-0503-31

    11-0503-31

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,339
    RFQ
    11-0503-31

    Datasheet

    0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    39-0518-00

    39-0518-00

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    3,450
    RFQ
    39-0518-00

    Datasheet

    518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-820-90

    14-820-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,234
    RFQ
    14-820-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    116-83-648-41-002101

    116-83-648-41-002101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    4,822
    RFQ
    116-83-648-41-002101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-314-T-H

    APO-314-T-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,406
    RFQ
    APO-314-T-H

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    HLS-0120-G-2

    HLS-0120-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,563
    RFQ
    HLS-0120-G-2

    Datasheet

    HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0314-TT-22

    HLS-0314-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,599
    RFQ
    HLS-0314-TT-22

    Datasheet

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-628-SGT-L

    ICA-628-SGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,305
    RFQ
    ICA-628-SGT-L

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 359360361362363364365366...955Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER