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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-632-41-013101

    116-87-632-41-013101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,492
    RFQ
    116-87-632-41-013101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-322-CGT

    ICO-322-CGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,331
    RFQ
    ICO-322-CGT

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    28-6501-20

    28-6501-20

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,178
    RFQ
    28-6501-20

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-71187-10

    06-71187-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    2,896
    RFQ
    06-71187-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-7360-10

    06-7360-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    2,945
    RFQ
    06-7360-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-7425-10

    06-7425-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    4,040
    RFQ
    06-7425-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-7755-10

    06-7755-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    3,365
    RFQ
    06-7755-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-9513-10T

    64-9513-10T

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,703
    RFQ
    64-9513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-632-WTT-3

    ICA-632-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,423
    RFQ
    ICA-632-WTT-3

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    346-93-127-41-013000

    346-93-127-41-013000

    CONN SOCKET SIP 27POS GOLD

    Mill-Max Manufacturing Corp.

    3,001
    RFQ
    346-93-127-41-013000

    Datasheet

    346 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-127-41-013000

    346-43-127-41-013000

    CONN SOCKET SIP 27POS GOLD

    Mill-Max Manufacturing Corp.

    2,740
    RFQ
    346-43-127-41-013000

    Datasheet

    346 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-324-WGT-3

    ICA-324-WGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,695
    RFQ
    ICA-324-WGT-3

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    14-6511-11

    14-6511-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,256
    RFQ
    14-6511-11

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-314-JGG

    ICA-314-JGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,195
    RFQ
    ICA-314-JGG

    Datasheet

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-JGG

    ICO-314-JGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,207
    RFQ
    ICO-314-JGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    110-47-304-41-105000

    110-47-304-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,451
    RFQ
    110-47-304-41-105000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-642-41-004101

    116-87-642-41-004101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,631
    RFQ
    116-87-642-41-004101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-652-41-009101

    116-83-652-41-009101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,806
    RFQ
    116-83-652-41-009101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-136-14-051101

    510-83-136-14-051101

    CONN SOCKET PGA 136POS GOLD

    Preci-Dip

    3,135
    RFQ
    510-83-136-14-051101

    Datasheet

    510 Bulk Active PGA 136 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3518-11H

    18-3518-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,258
    RFQ
    18-3518-11H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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