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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-6823-90

    10-6823-90

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 2,732
    RFQ
    		10-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    117-83-668-41-105101

    117-83-668-41-105101

    CONN IC DIP SOCKET 68POS GOLD

    Preci-Dip

    		 2,913
    RFQ
    		117-83-668-41-105101

    Datasheet

         		117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-207-17-081101

    510-87-207-17-081101

    CONN SOCKET PGA 207POS GOLD

    Preci-Dip

    		 4,371
    RFQ
    		510-87-207-17-081101

    Datasheet

         		510 Bulk Active PGA 207 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-207-17-082101

    510-87-207-17-082101

    CONN SOCKET PGA 207POS GOLD

    Preci-Dip

    		 2,113
    RFQ
    		510-87-207-17-082101

    Datasheet

         		510 Bulk Active PGA 207 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8060-1G12

    8060-1G12

    CONN TRANSIST TO-5 4POS GOLD

    TE Connectivity AMP Connectors

    		 4,454
    RFQ
    		8060-1G12

    Datasheet

         		8060 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
    14-823-90CV0

    14-823-90CV0

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,928
    RFQ

    -

    		 Vertisockets™ 800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-233-18-071101

    510-87-233-18-071101

    CONN SOCKET PGA 233POS GOLD

    Preci-Dip

    		 3,279
    RFQ
    		510-87-233-18-071101

    Datasheet

         		510 Bulk Active PGA 233 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-6501-20

    18-6501-20

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    		 2,610
    RFQ
    		18-6501-20

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0501-20

    12-0501-20

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    		 4,215
    RFQ
    		12-0501-20

    Datasheet

         		501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-128-13-041101

    510-83-128-13-041101

    CONN SOCKET PGA 128POS GOLD

    Preci-Dip

    		 2,245
    RFQ
    		510-83-128-13-041101

    Datasheet

         		510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-128-13-042101

    510-83-128-13-042101

    CONN SOCKET PGA 128POS GOLD

    Preci-Dip

    		 2,581
    RFQ
    		510-83-128-13-042101

    Datasheet

         		510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-128-13-043101

    510-83-128-13-043101

    CONN SOCKET PGA 128POS GOLD

    Preci-Dip

    		 4,168
    RFQ
    		510-83-128-13-043101

    Datasheet

         		510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-128-13-071101

    510-83-128-13-071101

    CONN SOCKET PGA 128POS GOLD

    Preci-Dip

    		 2,098
    RFQ
    		510-83-128-13-071101

    Datasheet

         		510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-41-304-31-012000

    614-41-304-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,988
    RFQ
    		614-41-304-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-012000

    614-91-304-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,643
    RFQ
    		614-91-304-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    26-0518-11H

    26-0518-11H

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 3,249
    RFQ
    		26-0518-11H

    Datasheet

         		518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-41-304-41-008000

    116-41-304-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,321
    RFQ
    		116-41-304-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-304-41-008000

    116-91-304-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,855
    RFQ
    		116-91-304-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-304-31-002000

    614-41-304-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,309
    RFQ
    		614-41-304-31-002000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-304-31-002000

    614-91-304-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,983
    RFQ
    		614-91-304-31-002000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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