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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    12-7500-10

    12-7500-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    		 2,138
    RFQ
    		12-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-7550-10

    12-7550-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    		 4,556
    RFQ
    		12-7550-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-7590-10

    12-7590-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    		 2,360
    RFQ
    		12-7590-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-7750-10

    12-7750-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    		 2,137
    RFQ
    		12-7750-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-1508-20

    22-1508-20

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,605
    RFQ
    		22-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    APA-324-T-C

    APA-324-T-C

    ADAPTER PLUG

    Samtec Inc.

    		 2,609
    RFQ
    		APA-324-T-C

    Datasheet

         		APA Bulk Active - 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    APA-624-T-C

    APA-624-T-C

    ADAPTER PLUG

    Samtec Inc.

    		 3,233
    RFQ
    		APA-624-T-C

    Datasheet

         		APA Bulk Active - 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    APO-324-T-C

    APO-324-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,339
    RFQ
    		APO-324-T-C

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    28-0518-11H

    28-0518-11H

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    		 4,994
    RFQ
    		28-0518-11H

    Datasheet

         		518 Bulk Active SIP 28 (1 x 28) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    28-1518-11H

    28-1518-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,951
    RFQ
    		28-1518-11H

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    116-83-628-41-013101

    116-83-628-41-013101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 2,776
    RFQ
    		116-83-628-41-013101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    ICA-316-ZHGT

    ICA-316-ZHGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,027
    RFQ
    		ICA-316-ZHGT

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    ICA-640-WTT-3

    ICA-640-WTT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,807
    RFQ
    		ICA-640-WTT-3

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
    40-9513-10T

    40-9513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,953
    RFQ
    		40-9513-10T

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    116-83-650-41-008101

    116-83-650-41-008101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 3,344
    RFQ
    		116-83-650-41-008101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    APO-632-T-A

    APO-632-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,861
    RFQ
    		APO-632-T-A

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    ICF-318-STL-O

    ICF-318-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 2,274
    RFQ
    		ICF-318-STL-O

    Datasheet

         		ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    08-0511-11

    08-0511-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 3,790
    RFQ
    		08-0511-11

    Datasheet

         		511 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    123-47-304-41-001000

    123-47-304-41-001000

    STANDARD WIRE WRAP DBL SKT

    Mill-Max Manufacturing Corp.

    		 4,125
    RFQ
    		123-47-304-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    18-0503-20

    18-0503-20

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    		 4,255
    RFQ
    		18-0503-20

    Datasheet

         		0503 Bulk Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
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