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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    18-0503-30

    18-0503-30

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,897
    RFQ
    18-0503-30

    Datasheet

    0503 Bulk Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    16-3508-201

    16-3508-201

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,724
    RFQ
    16-3508-201

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    116-93-304-41-008000

    116-93-304-41-008000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    3,927
    RFQ
    116-93-304-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-304-41-008000

    116-43-304-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,462
    RFQ
    116-43-304-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0306-T-18

    HLS-0306-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,531
    RFQ
    HLS-0306-T-18

    Datasheet

    HLS Tube Active SIP 18 (3 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    614-43-640-31-012000

    614-43-640-31-012000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    2,268
    RFQ
    614-43-640-31-012000

    Datasheet

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-83-650-41-001101

    116-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,749
    RFQ
    116-83-650-41-001101

    Datasheet

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    4-1437531-1

    4-1437531-1

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    2,940
    RFQ

    -

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold - - Copper Alloy
    ICF-322-SM-O

    ICF-322-SM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,453
    RFQ
    ICF-322-SM-O

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    ICF-322-S-I

    ICF-322-S-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,442
    RFQ
    ICF-322-S-I

    Datasheet

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
    510-83-132-13-002101

    510-83-132-13-002101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    2,854
    RFQ
    510-83-132-13-002101

    Datasheet

    510 Bulk Active PGA 132 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-83-132-13-042101

    510-83-132-13-042101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    4,946
    RFQ
    510-83-132-13-042101

    Datasheet

    510 Bulk Active PGA 132 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    APA-320-T-P

    APA-320-T-P

    ADAPTER PLUG

    Samtec Inc.

    2,164
    RFQ
    APA-320-T-P

    Datasheet

    APA Tube Active - 20 (2 x 10) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    18-3518-01

    18-3518-01

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,985
    RFQ
    18-3518-01

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-822-90

    16-822-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,432
    RFQ
    16-822-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    24-0517-90C

    24-0517-90C

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    3,205
    RFQ
    24-0517-90C

    Datasheet

    0517 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    510-87-241-18-071101

    510-87-241-18-071101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    3,729
    RFQ
    510-87-241-18-071101

    Datasheet

    510 Bulk Active PGA 241 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-241-18-072101

    510-87-241-18-072101

    CONN SOCKET PGA 241POS GOLD

    Preci-Dip

    4,028
    RFQ
    510-87-241-18-072101

    Datasheet

    510 Bulk Active PGA 241 (18 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    514-87-078-13-061117

    514-87-078-13-061117

    CONN SOCKET PGA 78POS GOLD

    Preci-Dip

    3,955
    RFQ
    514-87-078-13-061117

    Datasheet

    514 Bulk Active PGA 78 (13 x 13) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    ICA-624-ZWGT-3

    ICA-624-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,688
    RFQ
    ICA-624-ZWGT-3

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
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