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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICM-308-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 8P Adam Tech |
2,929 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-314-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 14P Adam Tech |
1,458 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-316-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 16P Adam Tech |
2,836 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
PLCC-44-AT-SMTPLCC SOCKET 44P SMT Adam Tech |
2,286 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 44 (4 x 11) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Thermoplastic | 80.0µin (2.03µm) | Phosphor Bronze |
|
ICM-318-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 18P Adam Tech |
2,175 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-624-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P Adam Tech |
1,631 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-320-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 20P Adam Tech |
633 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
PLCC-20-ATPLCC 20P THROUGH HOLE Adam Tech |
3,380 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 20 (4 x 5) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
PLCC-44-ATPLCC 44P THROUGH HOLE Adam Tech |
858 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 44 (4 x 11) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
PLCC-32-ATPLCC 32P THROUGH HOLE Adam Tech |
696 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
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