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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCC-32-AT-SMTPLCC SOCKET 32P SMT Adam Tech |
4,007 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
ICM-328-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P Adam Tech |
789 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-632-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 32P Adam Tech |
988 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-642-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 42P Adam Tech |
305 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
PLCC-84-ATPLCC 84P THROUGH HOLE Adam Tech |
522 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 84 (4 x 21) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
ICM-640-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 40P Adam Tech |
217 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
ICM-648-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 48P Adam Tech |
729 |
|
Datasheet |
ICM | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | - | Beryllium Copper |
|
PLCC-68-AT-SMTCONN SOCKET PLCC 68POS PHOS BRNZ Adam Tech |
1,421 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 68 (4 x 17) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
PLCC-52-ATPLCC 52P THROUGH HOLE Adam Tech |
1,872 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 52 (4 x 13) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
|
PLCC-84-AT-SMTPLCC SOCKET 84P SMT Adam Tech |
183 |
|
Datasheet |
PLCC | Tube | Active | PLCC | 84 (4 x 21) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 80.0µin (2.03µm) | Phosphor Bronze |
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