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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    614-93-310-31-007000

    614-93-310-31-007000

    SOCKET CARRIER LOWPRO .300 10POS

    Mill-Max Manufacturing Corp.

    		 3,979
    RFQ
    		614-93-310-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-41-210-41-001000

    123-41-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,347
    RFQ
    		123-41-210-41-001000

    Datasheet

         		123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-43-310-31-007000

    614-43-310-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,801
    RFQ
    		614-43-310-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    32-3551-10

    32-3551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,962
    RFQ
    		32-3551-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-3552-10

    32-3552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,408
    RFQ
    		32-3552-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-3553-10

    32-3553-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,154
    RFQ
    		32-3553-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-6552-10

    32-6552-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,545
    RFQ
    		32-6552-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-6553-10

    32-6553-10

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 3,265
    RFQ
    		32-6553-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    317-91-114-41-005000

    317-91-114-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    		 3,688
    RFQ
    		317-91-114-41-005000

    Datasheet

         		317 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-41-310-41-002000

    126-41-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,647
    RFQ
    		126-41-310-41-002000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-91-310-41-002000

    126-91-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,171
    RFQ
    		126-91-310-41-002000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0607-T-2-L

    HLS-0607-T-2-L

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,915
    RFQ
    		HLS-0607-T-2-L

    Datasheet

         		HLS Bulk Active SIP 42 (6 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    APH-0524-T-R

    APH-0524-T-R

    APH-0524-T-R

    Samtec Inc.

    		 2,062
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0920-T-T

    APH-0920-T-T

    APH-0920-T-T

    Samtec Inc.

    		 2,564
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0924-T-R

    APH-0924-T-R

    APH-0924-T-R

    Samtec Inc.

    		 4,636
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1424-T-R

    APH-1424-T-R

    APH-1424-T-R

    Samtec Inc.

    		 4,486
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1520-T-T

    APH-1520-T-T

    APH-1520-T-T

    Samtec Inc.

    		 3,521
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0624-T-R

    APH-0624-T-R

    APH-0624-T-R

    Samtec Inc.

    		 2,149
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0220-T-T

    APH-0220-T-T

    APH-0220-T-T

    Samtec Inc.

    		 4,182
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0324-T-R

    APH-0324-T-R

    APH-0324-T-R

    Samtec Inc.

    		 3,462
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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