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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    ICA-632-ZAGG

    ICA-632-ZAGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,385
    RFQ
    ICA-632-ZAGG

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    116-47-318-41-006000

    116-47-318-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,089
    RFQ
    116-47-318-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    612-11-306-41-001000

    612-11-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,293
    RFQ
    612-11-306-41-001000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    32-6511-11

    32-6511-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,194
    RFQ
    32-6511-11

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    317-91-115-41-005000

    317-91-115-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    3,094
    RFQ
    317-91-115-41-005000

    Datasheet

    317 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0310-G-11

    HLS-0310-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,886
    RFQ
    HLS-0310-G-11

    Datasheet

    HLS Tube Active SIP 27 (3 x 9) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    317-93-109-41-005000

    317-93-109-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,148
    RFQ
    317-93-109-41-005000

    Datasheet

    317 Tube Active SIP 9 (1 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APO-324-T-B

    APO-324-T-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,083
    RFQ
    APO-324-T-B

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    116-41-314-41-003000

    116-41-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,971
    RFQ
    116-41-314-41-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-314-41-003000

    116-91-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,603
    RFQ
    116-91-314-41-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-47-320-41-006000

    116-47-320-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,104
    RFQ
    116-47-320-41-006000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-47-420-41-006000

    116-47-420-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    3,714
    RFQ
    116-47-420-41-006000

    Datasheet

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    88-PGM13041-10

    88-PGM13041-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,256
    RFQ
    88-PGM13041-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    APH-0426-T-T

    APH-0426-T-T

    APH-0426-T-T

    Samtec Inc.

    2,134
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0926-T-T

    APH-0926-T-T

    APH-0926-T-T

    Samtec Inc.

    4,908
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0626-T-T

    APH-0626-T-T

    APH-0626-T-T

    Samtec Inc.

    4,135
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0826-T-T

    APH-0826-T-T

    APH-0826-T-T

    Samtec Inc.

    3,951
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    115-44-422-41-003000

    115-44-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,350
    RFQ
    115-44-422-41-003000

    Datasheet

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    25-0503-20

    25-0503-20

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    3,901
    RFQ
    25-0503-20

    Datasheet

    0503 Bulk Active SIP 25 (1 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    50-9518-10H

    50-9518-10H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,451
    RFQ
    50-9518-10H

    Datasheet

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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