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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
114-41-422-41-117000CONN IC SKT DBL |
4,581 |
|
Datasheet |
114 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
114-91-322-41-117000CONN IC SKT DBL |
4,500 |
|
Datasheet |
114 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
114-91-422-41-117000CONN IC SKT DBL |
3,757 |
|
Datasheet |
114 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
210-99-640-41-001000CONN IC DIP SOCKET 40POS TINLEAD |
3,285 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
210-44-640-41-001000STANDRD SOLDRTL DBL SKT |
3,156 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
116-83-652-41-004101CONN IC DIP SOCKET 52POS GOLD |
3,923 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
317-43-111-41-005000CONN SKT STRIP |
2,149 |
|
Datasheet |
317 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-47-636-41-001000STANDRD SOLDRTL |
2,975 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
612-41-310-41-001000SKT CARRIER SOLDRTL |
3,431 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
612-91-310-41-001000SKT CARRIER SOLDRTL |
3,226 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
115-47-422-41-003000CONN IC DIP SOCKET 22POS GOLD |
3,840 |
|
Datasheet |
115 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
612-41-308-41-001000SKT CARRIER SOLDRTL |
4,522 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
612-91-308-41-001000SKT CARRIER SOLDRTL |
3,086 |
|
Datasheet |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
917-41-210-41-005000CONN SKT TRANSISTOR |
2,865 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-100 | 10 (Round) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
917-91-210-41-005000CONN SKT TRANSISTOR |
3,069 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-100 | 10 (Round) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
714-43-222-31-018000CONN IC DIP SOCKET 22POS GOLD |
4,751 |
|
Datasheet |
714 | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
|
APH-0608-G-HAPH-0608-G-H |
3,546 |
|
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0208-G-HAPH-0208-G-H |
4,476 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1708-G-HAPH-1708-G-H |
3,744 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0808-G-HAPH-0808-G-H |
3,289 |
|
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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