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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-0908-G-H

    APH-0908-G-H

    APH-0908-G-H

    Samtec Inc.

    		 3,216
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1408-G-H

    APH-1408-G-H

    APH-1408-G-H

    Samtec Inc.

    		 4,214
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1808-G-H

    APH-1808-G-H

    APH-1808-G-H

    Samtec Inc.

    		 3,418
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-47-210-41-001000

    116-47-210-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 2,448
    RFQ
    		116-47-210-41-001000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    32-3513-11H

    32-3513-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,989
    RFQ
    		32-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    28-6503-20

    28-6503-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,602
    RFQ
    		28-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    28-6503-30

    28-6503-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,042
    RFQ
    		28-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    116-93-210-41-008000

    116-93-210-41-008000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,408
    RFQ
    		116-93-210-41-008000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-210-41-008000

    116-43-210-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,909
    RFQ
    		116-43-210-41-008000

    Datasheet

         		116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    510-83-236-17-061101

    510-83-236-17-061101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    		 2,323
    RFQ
    		510-83-236-17-061101

    Datasheet

         		510 Bulk Active PGA 236 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-83-236-17-062101

    510-83-236-17-062101

    CONN SOCKET PGA 236POS GOLD

    Preci-Dip

    		 3,888
    RFQ
    		510-83-236-17-062101

    Datasheet

         		510 Bulk Active PGA 236 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    110-43-304-61-001000

    110-43-304-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,469
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    104-11-210-41-770000

    104-11-210-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,680
    RFQ
    		104-11-210-41-770000

    Datasheet

         		104 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    121-11-310-41-001000

    121-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,998
    RFQ
    		121-11-310-41-001000

    Datasheet

         		121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    110-43-316-41-605000

    110-43-316-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,946
    RFQ
    		110-43-316-41-605000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-91-306-41-001000

    123-91-306-41-001000

    SOCKET IC OPEN 3 LVL .300 6POS

    Mill-Max Manufacturing Corp.

    		 2,736
    RFQ

    -

    		 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-41-306-41-001000

    123-41-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,844
    RFQ
    		123-41-306-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0510-S-2

    HLS-0510-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,014
    RFQ
    		HLS-0510-S-2

    Datasheet

         		HLS Bulk Active SIP 50 (5 x 10) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    25-71000-10

    25-71000-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 3,536
    RFQ
    		25-71000-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    25-71219-10

    25-71219-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 3,636
    RFQ
    		25-71219-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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