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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    114-93-422-41-117000

    114-93-422-41-117000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,679
    RFQ
    		114-93-422-41-117000

    Datasheet

         		114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-322-41-117000

    114-43-322-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,459
    RFQ
    		114-43-322-41-117000

    Datasheet

         		114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-422-41-117000

    114-43-422-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,259
    RFQ
    		114-43-422-41-117000

    Datasheet

         		114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-322-41-001000

    210-11-322-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,915
    RFQ
    		210-11-322-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-422-41-001000

    210-11-422-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,801
    RFQ
    		210-11-422-41-001000

    Datasheet

         		210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-318-41-007000

    116-41-318-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,261
    RFQ
    		116-41-318-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-318-41-007000

    116-91-318-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,899
    RFQ
    		116-91-318-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0220-T-31

    HLS-0220-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,713
    RFQ
    		HLS-0220-T-31

    Datasheet

         		HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    410-91-214-10-002000

    410-91-214-10-002000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 2,868
    RFQ
    		410-91-214-10-002000

    Datasheet

         		410 Tube Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100" (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-320-41-007000

    116-41-320-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,204
    RFQ
    		116-41-320-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-420-41-007000

    116-41-420-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,411
    RFQ
    		116-41-420-41-007000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-320-41-007000

    116-91-320-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,445
    RFQ
    		116-91-320-41-007000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-420-41-007000

    116-91-420-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,993
    RFQ
    		116-91-420-41-007000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-6556-11

    28-6556-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,629
    RFQ
    		28-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    36-3503-20

    36-3503-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,163
    RFQ
    		36-3503-20

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-3503-30

    36-3503-30

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 2,929
    RFQ
    		36-3503-30

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-81000-310C

    24-81000-310C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,157
    RFQ
    		24-81000-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-81250-310C

    24-81250-310C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,998
    RFQ
    		24-81250-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-8240-310C

    24-8240-310C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,515
    RFQ
    		24-8240-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-8300-310C

    24-8300-310C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,583
    RFQ
    		24-8300-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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