Hello! now KATY Electronic Technology Co., LTD+8618924632110（Bella)
KATY Electronic Technology Co., LTDMy Inquiry KATY Electronic Technology Co., LTDMy Account
    Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-0722-T-T

    APH-0722-T-T

    APH-0722-T-T

    Samtec Inc.

    		 2,516
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1622-T-T

    APH-1622-T-T

    APH-1622-T-T

    Samtec Inc.

    		 4,825
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0322-T-T

    APH-0322-T-T

    APH-0322-T-T

    Samtec Inc.

    		 2,572
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1722-T-T

    APH-1722-T-T

    APH-1722-T-T

    Samtec Inc.

    		 2,387
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1222-T-T

    APH-1222-T-T

    APH-1222-T-T

    Samtec Inc.

    		 2,222
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    124-41-310-41-002000

    124-41-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,948
    RFQ
    		124-41-310-41-002000

    Datasheet

         		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    124-91-310-41-002000

    124-91-310-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,072
    RFQ
    		124-91-310-41-002000

    Datasheet

         		124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    122-13-310-41-001000

    122-13-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,515
    RFQ
    		122-13-310-41-001000

    Datasheet

         		122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    110-11-624-41-001000

    110-11-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,361
    RFQ
    		110-11-624-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    110-11-324-41-001000

    110-11-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,261
    RFQ
    		110-11-324-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    110-11-424-41-001000

    110-11-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,219
    RFQ
    		110-11-424-41-001000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    40-1508-20

    40-1508-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,316
    RFQ
    		40-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    40-1508-30

    40-1508-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,918
    RFQ
    		40-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    605-93-314-11-480000

    605-93-314-11-480000

    SOCKET CARRIER LOWPRO .300 14POS

    Mill-Max Manufacturing Corp.

    		 4,644
    RFQ
    		605-93-314-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    605-43-314-11-480000

    605-43-314-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 3,465
    RFQ
    		605-43-314-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    22-0501-30

    22-0501-30

    CONN SOCKET SIP 22POS TIN

    Aries Electronics

    		 4,394
    RFQ
    		22-0501-30

    Datasheet

         		501 Bulk Active SIP 22 (1 x 22) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    317-93-116-41-005000

    317-93-116-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    		 3,572
    RFQ
    		317-93-116-41-005000

    Datasheet

         		317 Tube Active SIP 16 (1 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-11-310-41-001000

    123-11-310-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,678
    RFQ
    		123-11-310-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    110-41-632-41-105000

    110-41-632-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,675
    RFQ
    		110-41-632-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-91-632-41-105000

    110-91-632-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,342
    RFQ
    		110-91-632-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    Total 19086 Record«Prev1... 548549550551552553554555...955Next»
    Fast Shipping
    Fast Shipping Fast and convenient door to door delivery.
    Paypment Security
    Paypment Security More than 5 different secure payment methods.
    Strictly Quality Control
    Strictly Quality Control 365 days After-Sales Service and Warranty
    Simple And Professional
    Simple And Professional One-stop Electronics Procurement Solutions.
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

     KATY Electronic Technology Co., LTD

    PRODUCT

     KATY Electronic Technology Co., LTD

    PHONE

     KATY Electronic Technology Co., LTD

    USER
    KATY Electronic Technology Co., LTD
    [email protected]