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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-3553-10

    28-3553-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,455
    RFQ
    28-3553-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6552-10

    28-6552-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    4,871
    RFQ
    28-6552-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    317-93-120-41-005000

    317-93-120-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,987
    RFQ
    317-93-120-41-005000

    Datasheet

    317 Tube Active SIP 20 (1 x 20) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-316-41-003000

    116-93-316-41-003000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,326
    RFQ
    116-93-316-41-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-316-41-003000

    116-43-316-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,665
    RFQ
    116-43-316-41-003000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-314-G-Q

    APA-314-G-Q

    ADAPTER PLUG

    Samtec Inc.

    2,348
    RFQ
    APA-314-G-Q

    Datasheet

    APA Tube Active - 14 (2 x 7) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-93-314-41-008000

    116-93-314-41-008000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    4,747
    RFQ
    116-93-314-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-314-41-008000

    116-43-314-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,690
    RFQ
    116-43-314-41-008000

    Datasheet

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-93-117-41-005000

    317-93-117-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    3,208
    RFQ
    317-93-117-41-005000

    Datasheet

    317 Tube Active SIP 17 (1 x 17) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-47-642-41-001000

    111-47-642-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,972
    RFQ
    111-47-642-41-001000

    Datasheet

    111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-314-41-001000

    612-41-314-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,234
    RFQ
    612-41-314-41-001000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-314-41-001000

    612-91-314-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,253
    RFQ
    612-91-314-41-001000

    Datasheet

    612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-41-628-41-005000

    117-41-628-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,567
    RFQ
    117-41-628-41-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-91-628-41-005000

    117-91-628-41-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,077
    RFQ
    117-91-628-41-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-432-41-105000

    110-41-432-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,682
    RFQ
    110-41-432-41-105000

    Datasheet

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-432-41-105000

    110-91-432-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,176
    RFQ
    110-91-432-41-105000

    Datasheet

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0407-T-10

    HLS-0407-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,834
    RFQ
    HLS-0407-T-10

    Datasheet

    HLS Bulk Active SIP 28 (4 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    123-13-306-41-001000

    123-13-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,645
    RFQ
    123-13-306-41-001000

    Datasheet

    123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-318-41-001000

    210-13-318-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,725
    RFQ
    210-13-318-41-001000

    Datasheet

    210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-636-41-003000

    115-91-636-41-003000

    SOCKET IC OPEN LOWPRO .600 36POS

    Mill-Max Manufacturing Corp.

    3,687
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
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