Hello! now KATY Electronic Technology Co., LTD+8618924632110（Bella)
KATY Electronic Technology Co., LTDMy Inquiry KATY Electronic Technology Co., LTDMy Account
    Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    410-93-214-10-001000

    410-93-214-10-001000

    SOCKET DUAL IN-LINE SLDRTL 14POS

    Mill-Max Manufacturing Corp.

    		 4,406
    RFQ
    		410-93-214-10-001000

    Datasheet

         		410 Tube Active Zig-Zag, Left Stackable 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    38-6511-11

    38-6511-11

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 2,989
    RFQ
    		38-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-257-19-081101

    510-83-257-19-081101

    CONN SOCKET PGA 257POS GOLD

    Preci-Dip

    		 2,730
    RFQ
    		510-83-257-19-081101

    Datasheet

         		510 Bulk Active PGA 257 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-320-41-008000

    116-41-320-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,682
    RFQ
    		116-41-320-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-420-41-008000

    116-41-420-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,221
    RFQ
    		116-41-420-41-008000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-320-41-008000

    116-91-320-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,058
    RFQ
    		116-91-320-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-420-41-008000

    116-91-420-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,626
    RFQ
    		116-91-420-41-008000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-93-156-41-013000

    346-93-156-41-013000

    CONN SOCKET SIP 56POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,958
    RFQ
    		346-93-156-41-013000

    Datasheet

         		346 Bulk Active SIP 56 (1 x 56) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-156-41-013000

    346-43-156-41-013000

    CONN SOCKET SIP 56POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,912
    RFQ
    		346-43-156-41-013000

    Datasheet

         		346 Bulk Active SIP 56 (1 x 56) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-318-41-008000

    116-41-318-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,684
    RFQ
    		116-41-318-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-318-41-008000

    116-91-318-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,687
    RFQ
    		116-91-318-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    27-7580-10

    27-7580-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    		 3,382
    RFQ
    		27-7580-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    123-11-210-41-001000

    123-11-210-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,850
    RFQ
    		123-11-210-41-001000

    Datasheet

         		123 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-318-41-003000

    116-93-318-41-003000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,103
    RFQ
    		116-93-318-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-318-41-003000

    116-43-318-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,964
    RFQ
    		116-43-318-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-428-41-001000

    115-93-428-41-001000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,510
    RFQ
    		115-93-428-41-001000

    Datasheet

         		115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-428-41-001000

    115-43-428-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,660
    RFQ
    		115-43-428-41-001000

    Datasheet

         		115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-320-41-003000

    116-93-320-41-003000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,767
    RFQ
    		116-93-320-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-41-003000

    116-93-420-41-003000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,856
    RFQ
    		116-93-420-41-003000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-320-41-003000

    116-43-320-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,979
    RFQ
    		116-43-320-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 558559560561562563564565...955Next»
    Fast Shipping
    Fast Shipping Fast and convenient door to door delivery.
    Paypment Security
    Paypment Security More than 5 different secure payment methods.
    Strictly Quality Control
    Strictly Quality Control 365 days After-Sales Service and Warranty
    Simple And Professional
    Simple And Professional One-stop Electronics Procurement Solutions.
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

     KATY Electronic Technology Co., LTD

    PRODUCT

     KATY Electronic Technology Co., LTD

    PHONE

     KATY Electronic Technology Co., LTD

    USER
    KATY Electronic Technology Co., LTD
    [email protected]