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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
124-43-310-41-002000CONN IC SKT DBL |
3,520 |
|
Datasheet |
124 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
115-91-640-41-003000SOCKET IC OPEN LOWPRO .600 40POS |
3,231 |
|
- |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Thermoplastic | 200.0µin (5.08µm) | Brass Alloy |
|
|
115-41-640-41-003000CONN IC SKT DBL |
3,597 |
|
Datasheet |
115 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
114-47-640-41-117000STANDRD SOLDRTL DBL SKT |
3,291 |
|
Datasheet |
114 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
26-6820-90CCONN IC DIP SOCKET 26POS GOLD |
3,663 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 26 (2 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
26-6822-90CCONN IC DIP SOCKET 26POS GOLD |
3,441 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 26 (2 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
26-6823-90CCONN IC DIP SOCKET 26POS GOLD |
4,218 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 26 (2 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
26-820-90CCONN IC DIP SOCKET 26POS GOLD |
2,766 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
26-822-90CCONN IC DIP SOCKET 26POS GOLD |
2,176 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 26 (2 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
510-83-257-20-111101CONN SOCKET PGA 257POS GOLD |
3,586 |
|
Datasheet |
510 | Bulk | Active | PGA | 257 (20 x 20) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
117-47-428-41-005000STANDRD SOLDRTL |
3,397 |
|
Datasheet |
117 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
123-13-310-41-001000CONN IC DIP SOCKET 10POS GOLD |
4,230 |
|
Datasheet |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
|
614-41-316-31-018000SKT CARRIER PGA |
2,958 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
614-91-316-31-018000SKT CARRIER PGA |
3,099 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-91-650-41-001000CONN IC DIP SOCKET 50POS GOLD |
4,622 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
110-41-650-41-001000CONN IC SKT DBL |
2,809 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
HLS-0217-G-10.100" SCREW MACHINE SOCKET ARRAY |
4,183 |
|
Datasheet |
HLS | Tube | Active | SIP | 34 (2 x 17) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
HLS-0214-G-12.100" SCREW MACHINE SOCKET ARRAY |
4,485 |
|
Datasheet |
HLS | Tube | Active | SIP | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
APO-632-T-A1.100" LOW PROFILE SCREW MACHINE |
4,878 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
8060-1G6CONN TRANSIST TO-5 4POS GOLD |
2,934 |
|
Datasheet |
8060 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | Gold | - | Beryllium Copper | Panel Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Fluoropolymer (FP) | - | Beryllium Copper |
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