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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICO-324-JGG

    ICO-324-JGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,170
    RFQ
    		ICO-324-JGG

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-JGG

    ICA-624-JGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 2,596
    RFQ
    		ICA-624-JGG

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-41-320-31-007000

    614-41-320-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,469
    RFQ
    		614-41-320-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-31-007000

    614-41-420-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,555
    RFQ
    		614-41-420-31-007000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-31-007000

    614-91-320-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,371
    RFQ
    		614-91-320-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-31-007000

    614-91-420-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,190
    RFQ
    		614-91-420-31-007000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-328-41-006000

    116-41-328-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,839
    RFQ
    		116-41-328-41-006000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-428-41-006000

    116-41-428-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,620
    RFQ
    		116-41-428-41-006000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-628-41-006000

    116-41-628-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,584
    RFQ
    		116-41-628-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-328-41-006000

    116-91-328-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,059
    RFQ
    		116-91-328-41-006000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-428-41-006000

    116-91-428-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,543
    RFQ
    		116-91-428-41-006000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-628-41-006000

    116-91-628-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,539
    RFQ
    		116-91-628-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-002000

    614-41-318-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,065
    RFQ
    		614-41-318-31-002000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-002000

    614-91-318-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,711
    RFQ
    		614-91-318-31-002000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-007000

    614-41-318-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 2,358
    RFQ
    		614-41-318-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-007000

    614-91-318-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,660
    RFQ
    		614-91-318-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    410-93-214-10-002000

    410-93-214-10-002000

    SOCKET DUAL IN-LINE SLDRTL 14POS

    Mill-Max Manufacturing Corp.

    		 2,222
    RFQ
    		410-93-214-10-002000

    Datasheet

         		410 Tube Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-8730-310C

    20-8730-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,135
    RFQ
    		20-8730-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8770-310C

    20-8770-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,007
    RFQ
    		20-8770-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-320-41-001000

    126-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,629
    RFQ
    		126-41-320-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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