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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    40-3513-11H

    40-3513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,114
    RFQ
    		40-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    714-93-120-31-007000

    714-93-120-31-007000

    SOCKET CARRIER SIP 20POS

    Mill-Max Manufacturing Corp.

    		 4,381
    RFQ
    		714-93-120-31-007000

    Datasheet

         		714 Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-320-31-018000

    614-93-320-31-018000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,562
    RFQ
    		614-93-320-31-018000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-420-31-018000

    614-93-420-31-018000

    SOCKET CARRIER LOWPRO .400 20POS

    Mill-Max Manufacturing Corp.

    		 4,667
    RFQ
    		614-93-420-31-018000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-320-31-018000

    614-43-320-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,649
    RFQ
    		614-43-320-31-018000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-420-31-018000

    614-43-420-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,241
    RFQ
    		614-43-420-31-018000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3883-312-10-32

    3883-312-10-32

    SER 6556 UNIV TEST SCKT RECEP

    Aries Electronics

    		 2,257
    RFQ
    		3883-312-10-32

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    210-43-636-41-001000

    210-43-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,564
    RFQ
    		210-43-636-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-93-636-41-001000

    210-93-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,049
    RFQ
    		210-93-636-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-324-41-008000

    116-41-324-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,553
    RFQ
    		116-41-324-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-424-41-008000

    116-41-424-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,615
    RFQ
    		116-41-424-41-008000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-624-41-008000

    116-41-624-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,418
    RFQ
    		116-41-624-41-008000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-324-41-008000

    116-91-324-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,246
    RFQ
    		116-91-324-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-424-41-008000

    116-91-424-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,974
    RFQ
    		116-91-424-41-008000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-624-41-008000

    116-91-624-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,132
    RFQ
    		116-91-624-41-008000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-318-31-018000

    614-93-318-31-018000

    SOCKET CARRIER LOWPRO .300 18POS

    Mill-Max Manufacturing Corp.

    		 4,740
    RFQ
    		614-93-318-31-018000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-318-31-018000

    614-43-318-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,302
    RFQ
    		614-43-318-31-018000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-432-41-006000

    116-41-432-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,292
    RFQ
    		116-41-432-41-006000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-632-41-006000

    116-41-632-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,554
    RFQ
    		116-41-632-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-432-41-006000

    116-91-432-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,893
    RFQ
    		116-91-432-41-006000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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