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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    116-91-632-41-006000

    116-91-632-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,802
    RFQ
    		116-91-632-41-006000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    714-43-226-31-018000

    714-43-226-31-018000

    CONN IC DIP SOCKET 26POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,333
    RFQ
    		714-43-226-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 26 (2 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
    614-41-322-31-012000

    614-41-322-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,257
    RFQ
    		614-41-322-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-41-422-31-012000

    614-41-422-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,286
    RFQ
    		614-41-422-31-012000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-91-322-31-012000

    614-91-322-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,657
    RFQ
    		614-91-322-31-012000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    614-91-422-31-012000

    614-91-422-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,427
    RFQ
    		614-91-422-31-012000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    16-0511-11

    16-0511-11

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 4,165
    RFQ
    		16-0511-11

    Datasheet

         		511 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    116-41-320-41-001000

    116-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,542
    RFQ
    		116-41-320-41-001000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-41-420-41-001000

    116-41-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,219
    RFQ
    		116-41-420-41-001000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-320-41-001000

    116-91-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,467
    RFQ
    		116-91-320-41-001000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-91-420-41-001000

    116-91-420-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,679
    RFQ
    		116-91-420-41-001000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    APH-0424-T-T

    APH-0424-T-T

    APH-0424-T-T

    Samtec Inc.

    		 2,992
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1924-T-T

    APH-1924-T-T

    APH-1924-T-T

    Samtec Inc.

    		 4,926
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0924-T-T

    APH-0924-T-T

    APH-0924-T-T

    Samtec Inc.

    		 4,653
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1524-T-T

    APH-1524-T-T

    APH-1524-T-T

    Samtec Inc.

    		 3,485
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0224-T-T

    APH-0224-T-T

    APH-0224-T-T

    Samtec Inc.

    		 4,469
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0324-T-T

    APH-0324-T-T

    APH-0324-T-T

    Samtec Inc.

    		 3,887
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-93-324-41-003000

    116-93-324-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,028
    RFQ
    		116-93-324-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-424-41-003000

    116-93-424-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,481
    RFQ
    		116-93-424-41-003000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-624-41-003000

    116-93-624-41-003000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,321
    RFQ
    		116-93-624-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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