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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2255-929A-90-2401CONN TEST & BURN-IN BGA SOCKET 3M |
0 |
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- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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2320-9220-02-2401CONN TEST & BURN-IN BGA SOCKET 3M |
0 |
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- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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2432-9235-01-2401CONN TEST & BURN-IN BGA SOCKET 3M |
0 |
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- |
- | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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2256-6321-9UA-1902GRID ZIP 21 X 21 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 256 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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276-6321-9UA-1902TEST BURN-IN PGA 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 76 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2124-6313-9UA-1902TEST BURN-IN PGA 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 124 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2209-6317-9UA-1902GRID ZIP 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 209 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2225-6317-9UA-1902TEXTOOL 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2120-6313-9UA-1902PGA 13 X13 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 120 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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2361-6319-9UA-1902GRID ZIP 19 X 19 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 361 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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