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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
100-032-001CONN IC DIP SOCKET 32POS GOLD 3M |
2,086 |
|
- |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-040-000CONN IC DIP SOCKET 40POS GOLD 3M |
4,539 |
|
- |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-040-001CONN IC DIP SOCKET 40POS GOLD 3M |
2,431 |
|
- |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-042-000CONN IC DIP SOCKET 42POS GOLD 3M |
2,540 |
|
- |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-048-000CONN IC DIP SOCKET 48POS GOLD 3M |
3,409 |
|
- |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-006-050CONN IC DIP SOCKET 6POS GOLD 3M |
4,341 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-008-050CONN IC DIP SOCKET 8POS GOLD 3M |
4,343 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-008-051CONN IC DIP SOCKET 8POS GOLD 3M |
3,693 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-010-050CONN IC DIP SOCKET 10POS GOLD 3M |
3,436 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-014-050CONN IC DIP SOCKET 14POS GOLD 3M |
4,099 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
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