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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1035-2-1152-0B-00TEXTOOLTEST & BURN-IN BALL GRID 3M |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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1025-2-0572-0B-00TEXTOOLTEST & BURN-IN BALL GRID 3M |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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79300-20-0093M TEXTOOL FLEXIBLE ARRAY SOLUTI 3M |
0 |
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- |
Textool™ | Bulk | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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7100287881TEXTOOLFLEXIBLE ARRAY SOLUTIONS 3M |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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7010390893983-10 DOT IN-LN2"ES 6"X150YD-IN 3M |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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216-6278-00-3303CONN IC DIP SOCKET ZIF 16POS GLD 3M |
0 |
|
Datasheet |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
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232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD 3M |
0 |
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Datasheet |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled | -55°C ~ 105°C |
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218-7223-55-1902CONN SOCKET SOIC 18POS GOLD 3M |
0 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 18 (2 x 9) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C |
|
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200-6310-9UN-1900CONN SOCKET PGA ZIF 100POS GOLD 3M |
0 |
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Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 100 (10 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
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200-6311-9UN-1900CONN SOCKET PGA ZIF 121POS GOLD 3M |
0 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 121 (11 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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