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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
200-6313-9UN-1900CONN SOCKET PGA ZIF 169POS GOLD 3M |
2,347 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 150°C | Gold | Polyethersulfone (PES) | 30.0µin (0.76µm) | Beryllium Copper |
|
|
200-6315-9UN-1900CONN SOCKET PGA ZIF 225POS GOLD 3M |
2,976 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | - | - | - | - | - | 0.100" (2.54mm) | - | 0.100" (2.54mm) | -55°C ~ 150°C | - | Polyethersulfone (PES) | - | - |
|
|
200-6317-9UN-1900CONN SOCKET PGA ZIF 289POS GOLD 3M |
2,835 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 289 (17 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 150°C | Gold | Polyethersulfone (PES) | 30.0µin (0.76µm) | Beryllium Copper |
|
|
100-006-000CONN IC DIP SOCKET 6POS GOLD 3M |
2,691 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-008-000CONN IC DIP SOCKET 8POS GOLD 3M |
2,494 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-008-001CONN IC DIP SOCKET 8POS GOLD 3M |
2,400 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-010-000CONN IC DIP SOCKET 10POS GOLD 3M |
2,518 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-014-000CONN IC DIP SOCKET 14POS GOLD 3M |
3,390 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-014-001CONN IC DIP SOCKET 14POS GOLD 3M |
4,398 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-016-000CONN IC DIP SOCKET 16POS GOLD 3M |
3,815 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
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