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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
264-5205-01CONN SOCKET QFN 64POS GOLD 3M |
21 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 64 (4 x 16) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.020" (0.50mm) | Solder | 0.020" (0.50mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
|
288-4205-01CONN SOCKET QFN 88POS GOLD 3M |
11 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 88 (4 x 22) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.016" (0.40mm) | Solder | 0.016" (0.40mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
4820-3004-CPCONN IC DIP SOCKET 20POS TIN 3M |
534 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
4818-3000-CPCONN IC DIP SOCKET 18POS TIN 3M |
756 |
|
Datasheet |
4800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -25°C ~ 85°C | Tin | Polyester, Glass Filled | 35.0µin (0.90µm) | Phosphor Bronze |
|
228-1277-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD 3M |
21 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
218-3341-00-0602JCONN IC DIP SOCKET ZIF 18POS GLD 3M |
61 |
|
Datasheet |
Textool™ | Tray | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
216-7383-55-1902CONN SOCKET SOIC 16POS GOLD 3M |
58 |
|
Datasheet |
Textool™ | Bulk | Active | SOIC | 16 (2 x 8) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 150°C | Gold | Polyethersulfone (PES), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
232-1287-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD 3M |
34 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
210-2599-00-0602CONN SOCKET SIP ZIF 10POS GOLD 3M |
33 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 10 (1 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
224-5809-00-0602CONN SOCKET SIP ZIF 24POS GOLD 3M |
18 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 24 (1 x 24) | Gold | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
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