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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
232-2601-00-0602CONN SOCKET SIP ZIF 32POS GOLD 3M |
11 |
|
Datasheet |
Textool™ | Bulk | Active | SIP, ZIF (ZIP) | 32 (1 x 32) | Gold | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
240-5205-00CONN SOCKET QFN 40POS GOLD 3M |
6 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 40 (4 x 10) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
|
248-5205-00CONN SOCKET QFN 48POS GOLD 3M |
13 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 48 (4 x 12) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.020" (0.50mm) | Solder | - | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
|
224-5205-01CONN SOCKET QFN 24POS GOLD 3M |
22 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 24 (4x4) | Gold | - | Beryllium Copper | Through Hole | - | 0.020" (0.50mm) | Solder | - | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
251-5949-02-0602CONN ZIG-ZAG ZIF 51POS GOLD 3M |
13 |
|
Datasheet |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
248-4205-01CONN SOCKET QFN 48POS GOLD 3M |
14 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 48 (4 x 12) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.016" (0.40mm) | Solder | - | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
|
256-4205-01CONN SOCKET QFN 56POS GOLD 3M |
8 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 56 (4 x 14) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.016" (0.40mm) | Solder | 0.016" (0.40mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
|
280-5205-01CONN SOCKET QFN 80POS GOLD 3M |
10 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 80 (4 x 20) | Gold | - | Beryllium Copper | Through Hole | Open Frame | 0.020" (0.50mm) | Solder | 0.020" (0.50mm) | - | Gold | Polyethersulfone (PES) | - | Beryllium Copper |
|
8432-21A1-RK-TPCONN SOCKET PLCC 32POS TIN 3M |
78 |
|
Datasheet |
8400 | Tube | Active | PLCC | 32 (2 x 7, 2 x 9) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Copper Alloy |
|
232-1285-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD 3M |
24 |
|
Datasheet |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
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