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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    614-91-422-41-001000

    614-91-422-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 4,144
    RFQ
    		614-91-422-41-001000

    Datasheet

         		614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    121-11-316-41-001000

    121-11-316-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,003
    RFQ
    		121-11-316-41-001000

    Datasheet

         		121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    111-41-648-41-001000

    111-41-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,580
    RFQ
    		111-41-648-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-91-648-41-001000

    111-91-648-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,894
    RFQ
    		111-91-648-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-47-210-41-105000

    110-47-210-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,727
    RFQ
    		110-47-210-41-105000

    Datasheet

         		110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    8080-1G39

    8080-1G39

    CONN TRANSIST TO-3 3POS GOLD

    TE Connectivity AMP Connectors

    		 2,955
    RFQ
    		8080-1G39

    Datasheet

         		8060 Bulk Obsolete Transistor, TO-3 3 (Oval) Gold - Beryllium Copper Chassis Mount Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Beryllium Copper
    32-3570-10

    32-3570-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 4,597
    RFQ
    		32-3570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-3571-10

    32-3571-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,115
    RFQ
    		32-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-3572-10

    32-3572-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 2,785
    RFQ
    		32-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    32-3573-10

    32-3573-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 2,582
    RFQ
    		32-3573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    126-93-318-41-001000

    126-93-318-41-001000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,556
    RFQ
    		126-93-318-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-318-41-001000

    126-43-318-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,032
    RFQ
    		126-43-318-41-001000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-91-324-41-001000

    123-91-324-41-001000

    SOCKET IC OPEN 3 LVL .300 24POS

    Mill-Max Manufacturing Corp.

    		 2,492
    RFQ

    -

    		 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-91-424-41-001000

    123-91-424-41-001000

    SOCKET IC OPEN 3 LVL .400 24POS

    Mill-Max Manufacturing Corp.

    		 4,368
    RFQ

    -

    		 123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-91-624-41-001000

    123-91-624-41-001000

    SOCKET IC OPEN 3 LVL .600 24POS

    Mill-Max Manufacturing Corp.

    		 3,359
    RFQ

    -

    		 123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-41-324-41-001000

    123-41-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,691
    RFQ
    		123-41-324-41-001000

    Datasheet

         		123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-41-424-41-001000

    123-41-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,379
    RFQ
    		123-41-424-41-001000

    Datasheet

         		123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    123-41-624-41-001000

    123-41-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,823
    RFQ
    		123-41-624-41-001000

    Datasheet

         		123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-11-432-41-001000

    110-11-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,974
    RFQ
    		110-11-432-41-001000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    110-11-632-41-001000

    110-11-632-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,405
    RFQ
    		110-11-632-41-001000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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